Ausdia Joins TSMC Open Innovation Platform® (OIP) as EDA Alliance Partner

Ausdia has announced its participation in the TSMC Open Innovation Platform® (OIP) Electronic Design Automation (EDA) Alliance. As a new member of this esteemed ecosystem, Ausdia will integrate its Timevision™ platform with TSMC’s process technologies, delivering enhanced EDA tools to address the growing complexity of modern semiconductor designs.

“The addition of Ausdia to the TSMC EDA Alliance will further strengthen our OIP ecosystem and enable our mutual customers to manage complex designs efficiently,” said Dan Kochpatcharin, Head of the Ecosystem and Alliance Management Division at TSMC.

The TSMC OIP EDA Alliance brings together leading EDA tool providers to ensure optimized design methodologies and flows for TSMC’s advanced nodes. Ausdia’s inclusion in the alliance will enhance the ecosystem by providing cutting-edge constraint management and verification tools that support AI, automotive, and high-performance computing (HPC) designs with greater precision and efficiency.

“We are thrilled to join TSMC’s OIP EDA Alliance and bring our Timevision platform into this vibrant ecosystem,” said Sam Appleton, CEO of Ausdia. “This collaboration enables our mutual customers working on advanced designs to leverage TSMC’s state-of-the-art process nodes while optimizing timing constraints for improved performance and faster time-to-market.”

Ausdia’s Timevision platform offers a unique solution for developing and managing timing constraints, addressing challenges like memory usage and performance optimization in AI and large system-on-chip (SoC) designs. Through this partnership, Ausdia will deliver powerful constraint management solutions, streamlining the design process for semiconductor applications using TSMC’s leading technologies.

About Ausdia

Founded in 2006 and headquartered in Sunnyvale, California, Ausdia provides advanced timing constraint development, verification, and management solutions that integrate with all implementation and timing signoff flows. The Timevision platform supports designs with over 1 billion cells and thousands of clocks, enabling designers to significantly improve productivity and efficiency across the design lifecycle. Ausdia’s solutions are widely used by leading semiconductor companies for AI, HPC, and automotive SoCs and ICs. For more information, visit Ausdia’s website.

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