Category Technology

Introducing the Industry’s First Silicon-Proven 3nm, 24Gbps UCIe™ IP Subsystem with TSMC CoWoS® Technology

A global leader in high-speed connectivity and compute silicon for technology infrastructure has announced the release of the industry’s first silicon-proven 3nm Universal Chiplet Interconnect Express (UCIe™) Die-to-Die (D2D) IP…

Read MoreIntroducing the Industry’s First Silicon-Proven 3nm, 24Gbps UCIe™ IP Subsystem with TSMC CoWoS® Technology